by Sara McCaslin, PhD Sara McCaslin, PhD No Comments

Using Metal Seals Correctly

Using metal seals can be a viable alternative to polymer and rubber seals. They are used extensively in extreme applications, such as rocket engine nozzles and missile guidance housings, as well as in ultra-high-vacuum equipment and cryogenic transfer systems. This article focuses on where metal seals are used and the pros and cons of their use.

Where Using Metal Seals is a Good Approach

Metal seals do their best work in extreme environments where polymer and elastic seals typically fail, including extremely high temperatures (above 200°C) and pressures. 

For example, in the oil and gas industry, they are used with wellhead equipment, subsea Christmas trees, valve bonnets, and high-pressure pipework, which require metal ring gaskets (such as API ring joint gaskets) because they can withstand extreme downhole pressures and resist corrosive fluids.

In aerospace and defense, metal seals are found in rocket engine nozzles, spacecraft propulsion systems, and missile guidance housings. Such applications rely heavily on metal seals to maintain integrity through thermal cycling, vibration, and vacuum conditions.

The nuclear industry uses metal seals in reactor pressure vessels, containment flanges, and coolant piping. Metal seals (often manufactured from Inconel or stainless steel) perform extremely well because they resist radiation embrittlement and provide reliable long-term sealing without the problems associated with outgassing.

Semiconductor and vacuum systems employ metal seals in ultra-high-vacuum (UHV) equipment such as particle accelerators, electron microscopes, and chip fabrication chambers. These applications often use knife-edge metal seals (CF flanges) to achieve near-zero leak rates without risking contamination in clean environments.

Metal seals are also used in cryogenic applications, including liquid nitrogen or liquid hydrogen storage and transfer systems. Polymers become brittle at cryogenic temperatures, while soft metals like aluminum or copper remain ductile, making them an ideal solution for use at cryogenic temperatures.

Engineers also use metal seals extensively in chemical processing applications, such as reactors and heat exchangers, where aggressive acids, solvents, or oxidizers (which use metal spiral wound or ring gaskets)   are used. Metal seals work well where the chemical compatibility is a significant concern.

Benefits of Using Metal Seals

Metal seals used for several reasons. First, metal seals do not experience creep or relaxation when exposed to heavy, sustained loads, which can be a major issue with some elastomers and polymers. Depending on the material chosen, metal seals can also be engineered to be chemically inert to most process fluids, including strong acids, solvents,  alkalis, and oxidizers. In addition, they are not subject to permeation or outgassing issues that can occur with some elastomers. They are also inherently fire safe because of their high melting point, and can handle some of the most aggressive cleaning and sterilization processes.

Metal seals can also survive extreme thermal cycling without experiencing permanent set. In fact, metal seals exhibit excellent temperature resistance, with some metals capable of withstanding temperatures from -270°C to over 1000°C, which cannot be achieved with a polymer or elastomer. They can also handle extreme pressures, from ultra-high vacuum pressures to tens of thousands of psi. Finally, they experience a long service life in static applications and do not have a limited shelf life or aging concerns.

Things to Keep in Mind when Using Metal Seals

Metal seals do require stricter surface finish requirements than polymer and elastomeric solutions, and a high seating stress is required to achieve a reliable seal. Most metal seals are single-use, and the cost of their replacement can add up quickly over the equipment’s life cycle. Metal seals are also more sensitive to misalignment and vibration, which makes them unsuitable for applications involving thermal distortion across joints of movement. 

The raw material costs of metal seals (e.g., Inconel, stainless steel, titanium) and the precision machining required to manufacture them make them more expensive than their polymer and elastomeric options.  In addition, soft metals (e.g., copper, aluminum, soft iron) can gall or seize against the flange during installation, which can lead to expensive rework. Metal seals can also be difficult to disassemble and are not suitable for low-pressure applications. Finally, metal seals have limited self-healing properties.

Conclusion

Metal seals have applications where they significantly outperform their elastomer and polymer counterparts, including those involving temperature and pressure extremes. If you are in the process of selecting a metal seal for your design, contact the seal experts at Advanced EMC today.

by Sara McCaslin, PhD Sara McCaslin, PhD No Comments

Seals for Semiconductor Manufacturing 

Seals for semiconductor manufacturing involve critical choices related to the material used. And this is not surprising, given the high stakes of semiconductor fabrication, where a single contamination event or seal failure can compromise an entire wafer batch, costing hundreds of thousands of dollars in yield loss.

While seals are small and often overlooked in semiconductor manufacturing, they are exposed to some of the most aggressive conditions imaginable in any industrial environment. However, selecting the right material means not only a reliable seal but also improved equipment uptime, yield, and process integrity.

The Hostile Environment of Semiconductor Manufacturing

There are several factors that contribute to the extremely hostile environment that semiconductor manufacturing seals must be able to withstand. Seals in semiconductor equipment are regularly exposed to acids, bases, solvents, amine-based strippers, and chlorinated gases, depending on the process step. 

There is also exposure to plasma: fluorine and oxygen plasmas, commonly used in dry etch and resist stripping, are among the most chemically reactive environments currently known. In addition, plasma exposure will rapidly degrade traditional elastomers that lack full fluorination.

Another challenge lies in extreme temperatures and vacuum pressures. Processes such as CVD (Chemical Vapor Deposition) and LPCVD nitride deposition both demand good thermal stability under sustained high temperatures. Also, many chambers operate under vacuum conditions where outgassing becomes a critical failure mode for the seal material used.

There are also UHP (Ultra-high purity) requirements. In short, any ionic contamination, particulate generation, or elevated TOC (Total Organic Carbon) introduced by a seal can corrupt the process chemistry or inadvertently dope the wafer. This has serious repercussions for semiconductor manufacturing processes and quality.

Seals for Semiconductors: Application-Specific Demands

No single material or seal geometry will work for every process step, so requirements vary significantly by application. 

CVD and LPCVD demand thermal stability and vacuum-compatible materials with minimal outgassing. On the other hand, dry and wet etch processes will require a material that is plasma-resistant and compatible with fluorine-based gases and corrosive media. 

CMP is especially interesting as it presents a dual challenge: exposure to an abrasive slurry and high-pH chemistry. This necessitates seals with strong abrasion and chemical resistance. Also consider track and lithography equipment that prioritizes solvent resistance, as photoresist developers and solvents readily degrade standard elastomers. Finally, resist stripping adds yet another layer of complexity, requiring seals that can withstand aggressive strip chemistries and sustained ozone exposure.

ProcessPrimary Sealing ChallengeKey Material Requirements
CVD / LPCVDHigh-temperature vacuum operationThermal stability, vacuum compatibility, minimal outgassing
Dry & Wet EtchHighly aggressive etch chemistriesPlasma resistance, compatibility with fluorine-based gases, and acid/base media
CMPAbrasive, alkaline slurry exposureAbrasion resistance, high-pH chemical resistance
Track & LithographyPhotoresist solvent and developer exposureBroad solvent resistance, dimensional stability
Resist StrippingOzone and aggressive strip chemistry exposureExceptional chemical resistance, ozone resistance

Material Solutions: Engineering Polymers With Superior Performance

The primary candidate materials for semiconductor manufacturing sealing solutions are polymers selected for their ability to meet the overlapping requirements just described. The engineering polymers discussed are well-adapted to the challenges related to semiconductor manufacturing environments. 

FFKM (Perfluoroelastomer)

FFKM is considered the top choice for O-rings in semiconductor manufacturing. It is able to deliver the sealing force and resilience of rubber, but with the chemical compatibility of PTFE. It offers a wide operating temperature, approximately -15°F to 620°F. In addition, there are various grades available for  UHP applications that have been optimized for minimal extractable ion content, low metallic contamination, and enhanced O₂/F₂ plasma resistance. FFKM is suitable for static and limited dynamic applications across CVD, CMP, etch, lithography, and stripping processes.

PTFE (Polytetrafluoroethylene)

PTFE is known for its extremely low coefficient of friction, self-lubrication, exceptional chemical compatibility, and high purity. It also performs extremely well in high-temperature, corrosive environments that degrade other material options. Note that PTFE is often the material of choice for highly effective spring-energized seals and reliable encapsulated O-ring jackets.

PEEK (Polyether Ether Ketone)

Like PTFE, PEEK offers good wear resistance and moderate friction properties. It also offers low outgassing, good plasma resistance, and excellent dimensional stability at elevated service temperatures (which can prove crucial). Because of these properties, PEEK is a strong candidate for labyrinth seals and spring-energized seal lips in dynamic semiconductor applications.

Supporting Materials: PI, PCTFE, and PAI (Torlon)

There are some additional supporting materials, namely:

  • Polyimide (PI): known for its low outgassing, excellent cryogenic performance, and high purity
  • PCTFE: offers improved strength and hardness over PTFE while retaining excellent chemical inertness
  • PAI (Torlon): ideal where high pressure, cryogenic temperatures, and corrosive media are all part of the operating environment; known for excellent wear resistance and self-lubrication

Choosing the Right Material

ProcessRecommended MaterialsRationale
CVD / LPCVDFFKM, PEEK, PI (Polyimide)High thermal stability, low outgassing, vacuum-compatible; FFKM grades available for water vapor and ammonia processes
Dry & Wet EtchFFKM, PTFE, PCTFESuperior plasma resistance and broad chemical inertness, including fluorine-based gas compatibility; minimal particle generation
CMP (Chemical Mechanical Polishing)FFKM, PAI (Torlon), PEEKAbrasion-resistant with strong resistance to high-pH slurry chemistry; PAI offers excellent wear resistance and self-lubrication
Track & LithographyFFKM, PTFE, PCTFEBroad solvent resistance; chemically inert to photoresist solvents and developers that attack standard elastomers
Resist StrippingFFKM, PTFEOutstanding ozone resistance and broad chemical compatibility; FFKM specifically rated for ozone and aggressive strip process chemistry

Material selection for semiconductor sealing applications must be matched carefully to the demands of each individual process. For CVD and LPCVD, FFKM, PEEK, and polyimide (PI) are the leading candidates, as all three offer the thermal stability and low outgassing required for sustained high-temperature vacuum operation. Specialized FFKM grades are also available that are formulated specifically for processes involving water vapor and ammonia.

In dry and wet etch environments, FFKM, PTFE, and PCTFE are the materials of choice, owing to their broad chemical inertness and resistance to fluorine-based plasmas and corrosive etch chemistries. Minimal particle generation is a critical secondary requirement in these applications, and all three materials perform well in this regard. For CMP, the combination of abrasive slurry and high-pH chemistry narrows the field to FFKM, PAI (Torlon), and PEEK, with PAI offering a particular advantage due to its exceptional wear resistance and self-lubricating properties.

Track and lithography equipment demands seals that can withstand the photoresist solvents and developers that rapidly degrade conventional elastomers, making FFKM, PTFE, and PCTFE the preferred options given their broad solvent resistance and dimensional stability. Resist stripping represents perhaps the most chemically aggressive environment of all, with ozone exposure compounding an already demanding chemical profile. Here, FFKM and PTFE are the primary recommendations, with select FFKM grades formulated specifically for ozone-intensive strip process chemistry.

Conclusion

In semiconductor manufacturing applications, the seal material selection has an incredible impact on process reliability, contamination control, and total cost of ownership. And there is no universal, one-size-fits-all solution to choosing a seal material. Engineers must look for the optimal combination of material properties to be matched to each process step’s specific chemical, thermal, and purity demands and there are engineering polymers available that are ideal for different applications.

 Advanced EMC is your partner when it comes to semiconductor sealing solutions. With over 100 years of combined experience, Advanced EMC has access to UHP-grade FFKM along with a full range of engineered polymer seal type. The Advanced EMC Sealing Solutions Team is ready to identify and supply the right sealing solution for any semiconductor application, whether standard or custom-designed. Contact Advanced EMC today for a consultation or to request a quote.