by Sara McCaslin, PhD Sara McCaslin, PhD No Comments

Seals for Semiconductor Manufacturing 

Seals for semiconductor manufacturing involve critical choices related to the material used. And this is not surprising, given the high stakes of semiconductor fabrication, where a single contamination event or seal failure can compromise an entire wafer batch, costing hundreds of thousands of dollars in yield loss.

While seals are small and often overlooked in semiconductor manufacturing, they are exposed to some of the most aggressive conditions imaginable in any industrial environment. However, selecting the right material means not only a reliable seal but also improved equipment uptime, yield, and process integrity.

The Hostile Environment of Semiconductor Manufacturing

There are several factors that contribute to the extremely hostile environment that semiconductor manufacturing seals must be able to withstand. Seals in semiconductor equipment are regularly exposed to acids, bases, solvents, amine-based strippers, and chlorinated gases, depending on the process step. 

There is also exposure to plasma: fluorine and oxygen plasmas, commonly used in dry etch and resist stripping, are among the most chemically reactive environments currently known. In addition, plasma exposure will rapidly degrade traditional elastomers that lack full fluorination.

Another challenge lies in extreme temperatures and vacuum pressures. Processes such as CVD (Chemical Vapor Deposition) and LPCVD nitride deposition both demand good thermal stability under sustained high temperatures. Also, many chambers operate under vacuum conditions where outgassing becomes a critical failure mode for the seal material used.

There are also UHP (Ultra-high purity) requirements. In short, any ionic contamination, particulate generation, or elevated TOC (Total Organic Carbon) introduced by a seal can corrupt the process chemistry or inadvertently dope the wafer. This has serious repercussions for semiconductor manufacturing processes and quality.

Seals for Semiconductors: Application-Specific Demands

No single material or seal geometry will work for every process step, so requirements vary significantly by application. 

CVD and LPCVD demand thermal stability and vacuum-compatible materials with minimal outgassing. On the other hand, dry and wet etch processes will require a material that is plasma-resistant and compatible with fluorine-based gases and corrosive media. 

CMP is especially interesting as it presents a dual challenge: exposure to an abrasive slurry and high-pH chemistry. This necessitates seals with strong abrasion and chemical resistance. Also consider track and lithography equipment that prioritizes solvent resistance, as photoresist developers and solvents readily degrade standard elastomers. Finally, resist stripping adds yet another layer of complexity, requiring seals that can withstand aggressive strip chemistries and sustained ozone exposure.

ProcessPrimary Sealing ChallengeKey Material Requirements
CVD / LPCVDHigh-temperature vacuum operationThermal stability, vacuum compatibility, minimal outgassing
Dry & Wet EtchHighly aggressive etch chemistriesPlasma resistance, compatibility with fluorine-based gases, and acid/base media
CMPAbrasive, alkaline slurry exposureAbrasion resistance, high-pH chemical resistance
Track & LithographyPhotoresist solvent and developer exposureBroad solvent resistance, dimensional stability
Resist StrippingOzone and aggressive strip chemistry exposureExceptional chemical resistance, ozone resistance

Material Solutions: Engineering Polymers With Superior Performance

The primary candidate materials for semiconductor manufacturing sealing solutions are polymers selected for their ability to meet the overlapping requirements just described. The engineering polymers discussed are well-adapted to the challenges related to semiconductor manufacturing environments. 

FFKM (Perfluoroelastomer)

FFKM is considered the top choice for O-rings in semiconductor manufacturing. It is able to deliver the sealing force and resilience of rubber, but with the chemical compatibility of PTFE. It offers a wide operating temperature, approximately -15°F to 620°F. In addition, there are various grades available for  UHP applications that have been optimized for minimal extractable ion content, low metallic contamination, and enhanced O₂/F₂ plasma resistance. FFKM is suitable for static and limited dynamic applications across CVD, CMP, etch, lithography, and stripping processes.

PTFE (Polytetrafluoroethylene)

PTFE is known for its extremely low coefficient of friction, self-lubrication, exceptional chemical compatibility, and high purity. It also performs extremely well in high-temperature, corrosive environments that degrade other material options. Note that PTFE is often the material of choice for highly effective spring-energized seals and reliable encapsulated O-ring jackets.

PEEK (Polyether Ether Ketone)

Like PTFE, PEEK offers good wear resistance and moderate friction properties. It also offers low outgassing, good plasma resistance, and excellent dimensional stability at elevated service temperatures (which can prove crucial). Because of these properties, PEEK is a strong candidate for labyrinth seals and spring-energized seal lips in dynamic semiconductor applications.

Supporting Materials: PI, PCTFE, and PAI (Torlon)

There are some additional supporting materials, namely:

  • Polyimide (PI): known for its low outgassing, excellent cryogenic performance, and high purity
  • PCTFE: offers improved strength and hardness over PTFE while retaining excellent chemical inertness
  • PAI (Torlon): ideal where high pressure, cryogenic temperatures, and corrosive media are all part of the operating environment; known for excellent wear resistance and self-lubrication

Choosing the Right Material

ProcessRecommended MaterialsRationale
CVD / LPCVDFFKM, PEEK, PI (Polyimide)High thermal stability, low outgassing, vacuum-compatible; FFKM grades available for water vapor and ammonia processes
Dry & Wet EtchFFKM, PTFE, PCTFESuperior plasma resistance and broad chemical inertness, including fluorine-based gas compatibility; minimal particle generation
CMP (Chemical Mechanical Polishing)FFKM, PAI (Torlon), PEEKAbrasion-resistant with strong resistance to high-pH slurry chemistry; PAI offers excellent wear resistance and self-lubrication
Track & LithographyFFKM, PTFE, PCTFEBroad solvent resistance; chemically inert to photoresist solvents and developers that attack standard elastomers
Resist StrippingFFKM, PTFEOutstanding ozone resistance and broad chemical compatibility; FFKM specifically rated for ozone and aggressive strip process chemistry

Material selection for semiconductor sealing applications must be matched carefully to the demands of each individual process. For CVD and LPCVD, FFKM, PEEK, and polyimide (PI) are the leading candidates, as all three offer the thermal stability and low outgassing required for sustained high-temperature vacuum operation. Specialized FFKM grades are also available that are formulated specifically for processes involving water vapor and ammonia.

In dry and wet etch environments, FFKM, PTFE, and PCTFE are the materials of choice, owing to their broad chemical inertness and resistance to fluorine-based plasmas and corrosive etch chemistries. Minimal particle generation is a critical secondary requirement in these applications, and all three materials perform well in this regard. For CMP, the combination of abrasive slurry and high-pH chemistry narrows the field to FFKM, PAI (Torlon), and PEEK, with PAI offering a particular advantage due to its exceptional wear resistance and self-lubricating properties.

Track and lithography equipment demands seals that can withstand the photoresist solvents and developers that rapidly degrade conventional elastomers, making FFKM, PTFE, and PCTFE the preferred options given their broad solvent resistance and dimensional stability. Resist stripping represents perhaps the most chemically aggressive environment of all, with ozone exposure compounding an already demanding chemical profile. Here, FFKM and PTFE are the primary recommendations, with select FFKM grades formulated specifically for ozone-intensive strip process chemistry.

Conclusion

In semiconductor manufacturing applications, the seal material selection has an incredible impact on process reliability, contamination control, and total cost of ownership. And there is no universal, one-size-fits-all solution to choosing a seal material. Engineers must look for the optimal combination of material properties to be matched to each process step’s specific chemical, thermal, and purity demands and there are engineering polymers available that are ideal for different applications.

 Advanced EMC is your partner when it comes to semiconductor sealing solutions. With over 100 years of combined experience, Advanced EMC has access to UHP-grade FFKM along with a full range of engineered polymer seal type. The Advanced EMC Sealing Solutions Team is ready to identify and supply the right sealing solution for any semiconductor application, whether standard or custom-designed. Contact Advanced EMC today for a consultation or to request a quote.

by Sara McCaslin, PhD Sara McCaslin, PhD No Comments

Electrical Conductivity in Polymers: When Plastics Carry Current

Electrical conductivity in polymers is not something commonly discussed. But there are times that a polymer component must control static charge, provide a grounding path, or contribute to EMI shielding. In such cases, electrical conductivity becomes a design requirement where the goal is not to make plastics behave like copper but to engineer a stable, predictable pathway for charge or current under real operating conditions.

The demand for such designs is rapidly increasing. For example, electronics handling is sensitive to ESD, and electrified machinery needs lightweight components that also support continuity. Chemical environments push designers away from metals, even when electrical performance still matters.

The objective of this blog post is to discuss electrical conductivity in polymers, how it works, what fillers are involved, and what both processing and testing look like.

Electrical Conductivity in Polymers: What It Means

Electrical performance in polymer components is usually specified using resistivity, and two metrics are used most often. Volume resistivity refers to charge transport through the bulk of the part. It is the right metric when the component must carry current from one face to another, or when the electrical path must remain reliable after minor surface wear.

Surface resistivity, on the other hand, reflects charge movement along the surface. It can change with surface finish, machining effects, humidity, and residues from cleaning or handling. For many assemblies, surface behavior drives field performance.

Also, keep in mind that not every application requires true electrical conduction. Many applications need controlled dissipation instead. Its goal is to prevent charge accumulation without creating a rapid discharge event. 

How Electrical Conductivity in Polymers Works

Unfilled polymers do not conduct electricity because they lack mobile charge carriers and continuous pathways. Conductive behavior must be created by introducing a filler system that forms a connected network through the matrix.

This connected network is controlled by the percolation threshold. Below that threshold, particles are too isolated to provide continuity. Near the percolation threshold, however, small changes in filler loading, dispersion quality, or processing conditions can cause large changes in resistivity.

Fillers

Conductive fillers enable conductivity in polymers, but each filler has its own tradeoffs. Electrical performance, mechanical properties, and processing stability must be considered together when specifying a polymer filler for effective conduction.

Carbon black is widely used for ESD and static-dissipative grades. It is cost-effective and typically easier to source than specialty fillers. Higher loadings can increase melt viscosity and can reduce toughness, especially in applications that experience impact or cyclic strain.

Graphite supports conductivity while improving lubricity. This filler is often selected for wear components where tribology and debris control matter greatly. The conductivity achieved depends on particle morphology and dispersion, so design considerations should include processing variability.

Carbon fiber filler can improve conductivity while also improving stiffness and strength. This filler also introduces strong directionality for some of its properties. In molded parts, note that the flow orientation can result in higher conductivity along one axis. That can be beneficial when designed intentionally, but it can introduce potential failure modes when not taken into account. 

High aspect ratio fillers like carbon nanotubes and graphene nanoplatelets can achieve meaningful conductivity at relatively low filler loading, with the practical challenge being dispersion. Consistent electrical performance requires process control and robust quality verification, particularly for high-reliability applications.

Finally, metal fibers, flakes, and metal-coated particles can provide excellent conductivity while heavily contributing to EMI shielding. However, these fillers increase density and can affect wear behavior, which can be a serious issue for some applications. Depending on the environment and mating hardware, corrosion and galvanic interactions may also need to be evaluated.

Filler typeConductivity potentialMechanical impactProcessing difficulty
Carbon blackMediumMediumMedium
GraphiteMediumLow to MediumLow to Medium
Carbon fiberMedium to High (directional)High (stiffness up, toughness may drop)Medium
CNTHighLow to MediumHigh
Graphene nanoplateletsMedium to HighLow to MediumHigh
Metal or metal-coatedHighMedium to HighMedium to High

Processing for Electrical Conductivity in Polymer Components

Electrical performance in polymer components is not solely determined by filler type, but rather by how the material is compounded, shaped, and finished.

For example, poor filler dispersion creates conductive “islands” that separatedated by insulating regions. Poor dispersion can produce inconsistent resistance across the art, and unpredictable results at contact poinA And component can pass a basic resistivity check and still fail in assembly because of localized variability in how well the filler material is dispersed.

Fiber and platelet systems can be anisotropic, which means the behavior of the material is highly dependent on the direction. For injection molded parts, for example, the skin-core structure and flow direction can lead to significant differences in resistivity by axis. If the design requires isotropic conductivity, this must be addressed through filler selection, gating strategy, or alternative processing routes.

Another example is how surface resistivity can be sensitive to simple things like machining smear, polishing, and the presence of cleaning residues. If surface conduction is extremely important, validate the electrical performance after final finishing and cleaning is complete — do not rely solely on “as molded” test coupons.

Tips for Designing Polymer Components for Conductivity

Once a polymer component is required to carry current or control charge, the interface design becomes extremely critical. First, the bulk conductivity is not going to guarantee electrical continuity through the assembly, and contact resistance is often the limiting factor. Surface finish, contact pressure, oxidation on mating metals, vibration, and thermal cycling all influence the electrical performance. There, thefore electrical contact region should be treated as a functional feature and not a basic interface.

Next, keep in mind that polymers do not spread heat efficiently. Local Joule heating at contact points can cause softening, creep, and resistance drift, which can all be problematic. In addition, current level, duty cycle, and allowable temperature rise should be specified early on in the design process because they are difficult to recover later.

In addition, fillers usually raise the modulus of elasticity and reduce elongation. Furthermore, notches and sharp corners in the design become more critical issues. If the part is going to see snap-fit strain, impact, or cyclic loading, then the geometry and material selection must be closely aligned with the reduced toughness that is typical of many conductive polymers.

Uses

Electrical conductivity in polymers supports several established application areas. Dissipative polymers, for example, are used for semiconductor handling fixtures, device nests, guides, and transport components. The objective is controlled charge bleed-off and reduced risk of sudden discharge. Conductive polymer housings, covers, and internal structural elements can support grounding strategies while reducing weight and improving corrosion resistance compared to many metal solutions.

Some wear components must maintain electrical continuity during motion, which can be a demanding requirement. It should be validated with wear testing, resistance monitoring, and debris evaluation, not inferred from bulk material properties.

Static dissipation can be important in powder handling, fuel-related environments, and certain chemical processing systems. In such cases, controlled dissipation is often the priority rather for the polymer components as opposed to high current capacity.

Conclusion

Electrical conductivity in polymers is achievable, but it must be engineered and verified. Filler selection sets the baseline, processing determines whether the conductive network is consistent, and careful interface design determines whether the assembly performs. 

If you are looking for a solution to your electrically conductive polymer design, contact Advanced EMC today. Our engineers are looking forward to talking with you.