by Sara McCaslin, PhD Sara McCaslin, PhD No Comments

Polymer Bearings for Subsea Robotics: Surviving Pressure, Saltwater, and Zero-Maintenance Windows

The ocean floor remains one of the most unforgiving environments on Earth. Remotely operated vehicles (ROVs) and autonomous underwater vehicles (AUVs) descend thousands of meters to inspect pipelines, support offshore drilling, and conduct scientific surveys. And these ROVS do all of this in conditions that would destroy conventional mechanical components within hours, including bearings. For engineers designing subsea robotic systems, the question is never whether the environment will push the hardware to its limits. The question is whether the hardware is ready for it.

Bearings are among the most critical and vulnerable components in a subsea robot’s drivetrain, joint assemblies, and thruster systems. Make the wrong design choice here, and the entire mission fails. Make the right design choice, and you have a system that can run reliably at depth for extended deployments without ever surfacing for a service interval. Polymer bearings for subsea robotics are emerging as the answer for engineers who are finding that conventional metal bearings simply cannot provide the performance needed in the harsh environment beneath the ocean.

Pressure, Saltwater, and Maintenance-Free Operation

Subsea robotics engineers, whether they are designing robots for inspecting oil and gas pipelines or monitoring fish farms, face three specific challenges that conventional bearing materials are not designed to handle simultaneously: hydrostatic pressure, saltwater corrosion, and lubrication.

Hydrostatic pressure increases by roughly one atmosphere for every 10 meters (~32.8 ft) of depth. At 3,000 meters (~9840 ft), which is a routine working depth for deepwater inspection ROVs, the pressure exceeds 300 atmospheres. Metal bearings rely heavily on lubrication films and tight tolerances that can easily be compromised under such loads. Pressure-induced deformation, lubricant displacement, and housing distortion can all cause premature failure.

Saltwater corrosion is another relentless issue that must be addressed for successful bearing performance. Corrosion degrades surface finish, tightens clearances, and eventually seizes rotating assemblies entirely. Marine environments expose bearing surfaces to chloride ions, dissolved oxygen, and biological fouling. Steel bearings corrode; bronze bearings can undergo dezincification; and even stainless alloys remain vulnerable to crevice corrosion in low-oxygen zones.

Zero-maintenance windows may be the most operationally demanding constraint of all. A bearing on an offshore ROV working a deepwater site cannot be pulled, inspected, relubricated, or replaced on a daily basis. Many deployments run for weeks or months between topside recovery. Polymer bearings, such as those made from PEEK or PTFE composites, eliminate the need for periodic lubrication or adjustments, reducing operational costs and downtime, and ensuring continuous mission success because they are self-lubricating.

Polymer Bearings: Material Solutions for Subsea Demands

Bearing-grade polymer materials address all three of these challenges — pressure, saltwater, and maintenance-free operation — often simultaneously. Several proven engineering polymers stand out as solutions that can inspire confidence in subsea robotic applications.

PEEK (Polyether ether ketone) is the workhorse of high-performance polymer bearings in subsea use. It maintains exceptional dimensional stability even under hydrostatic loading, exhibits near-zero water absorption, and resists saltwater, hydraulic fluids, and most chemicals commonly encountered in offshore environments. Furthermore, PEEK bearings operate without external lubrication, drawing instead on the material’s inherently low friction coefficient. For ROV thruster assemblies and joint pivots, PEEK offers a compressive strength that approaches or exceeds many metal alloys while eliminating corrosion.

Filled PTFE successfully extends the lubrication-free advantage further. Unfilled PTFE is too soft for structural bearing applications, but glass-filled, carbon-filled, or bronze-filled PTFE delivers self-lubricating performance with meaningful load capacity and low friction. In slow-rotation or oscillating applications, such as the articulating arms of an inspection ROV, field PTfE bearings provide a smooth, stick-slip-free motion with no maintenance requirement and complete resistance to saltwater attack.

UHMWPE (Ultra-High Molecular Weight Polyethylene) brings outstanding impact resistance and surface toughness to applications where debris ingestion is a risk. Its extremely low coefficient of friction, combined with high chemical resistance and excellent fatigue life in wet environments, makes it well-suited for guide bearings and bushing applications in subsea manipulators and cable management systems.

Finally, Torlon (PAI, Polyamide-imide) is ideal for harsh, high-temperature, and high-load bearing applications where even PEEK approaches its limits. With excellent creep resistance and impressive compressive strength, Torlon-based bearings perform well in compact, high-load joint designs where space constraints are tight, and operating cycles are demanding.

Building Reliability Into Every Depth

The common thread across all of these materials is simple: each one removes a failure mode that metal bearings experience in the subsea environment. No corrosion, no lubrication intervals, dimensional stability under pressure, and compatibility with the full range of subsea fluids and cleaning agents are critical properties that high-performance polymers such as PEEK, filled PTFE, UHMWPE, and Torlon possess. 

For operators running extended deepwater missions, polymer bearings are not merely an alternative to metal bearings; they are the more reliable choice. Lower system weight, reduced drag on thruster assemblies, and the elimination of corrosion-driven maintenance costs all contribute to a lower total cost of ownership over the working life of AUVs and ROVs.

Ready to specify the right bearing material for your subsea robotic application? The bearing experts at Advanced EMC have strong expertise in bearing-grade polymers for even the most demanding marine and offshore environments. Contact Advanced EMC today to discuss your project requirements and get material recommendations backed by real engineering experience.

by Sara McCaslin, PhD Sara McCaslin, PhD No Comments

Seals for Semiconductor Manufacturing 

Seals for semiconductor manufacturing involve critical choices related to the material used. And this is not surprising, given the high stakes of semiconductor fabrication, where a single contamination event or seal failure can compromise an entire wafer batch, costing hundreds of thousands of dollars in yield loss.

While seals are small and often overlooked in semiconductor manufacturing, they are exposed to some of the most aggressive conditions imaginable in any industrial environment. However, selecting the right material means not only a reliable seal but also improved equipment uptime, yield, and process integrity.

The Hostile Environment of Semiconductor Manufacturing

There are several factors that contribute to the extremely hostile environment that semiconductor manufacturing seals must be able to withstand. Seals in semiconductor equipment are regularly exposed to acids, bases, solvents, amine-based strippers, and chlorinated gases, depending on the process step. 

There is also exposure to plasma: fluorine and oxygen plasmas, commonly used in dry etch and resist stripping, are among the most chemically reactive environments currently known. In addition, plasma exposure will rapidly degrade traditional elastomers that lack full fluorination.

Another challenge lies in extreme temperatures and vacuum pressures. Processes such as CVD (Chemical Vapor Deposition) and LPCVD nitride deposition both demand good thermal stability under sustained high temperatures. Also, many chambers operate under vacuum conditions where outgassing becomes a critical failure mode for the seal material used.

There are also UHP (Ultra-high purity) requirements. In short, any ionic contamination, particulate generation, or elevated TOC (Total Organic Carbon) introduced by a seal can corrupt the process chemistry or inadvertently dope the wafer. This has serious repercussions for semiconductor manufacturing processes and quality.

Seals for Semiconductors: Application-Specific Demands

No single material or seal geometry will work for every process step, so requirements vary significantly by application. 

CVD and LPCVD demand thermal stability and vacuum-compatible materials with minimal outgassing. On the other hand, dry and wet etch processes will require a material that is plasma-resistant and compatible with fluorine-based gases and corrosive media. 

CMP is especially interesting as it presents a dual challenge: exposure to an abrasive slurry and high-pH chemistry. This necessitates seals with strong abrasion and chemical resistance. Also consider track and lithography equipment that prioritizes solvent resistance, as photoresist developers and solvents readily degrade standard elastomers. Finally, resist stripping adds yet another layer of complexity, requiring seals that can withstand aggressive strip chemistries and sustained ozone exposure.

ProcessPrimary Sealing ChallengeKey Material Requirements
CVD / LPCVDHigh-temperature vacuum operationThermal stability, vacuum compatibility, minimal outgassing
Dry & Wet EtchHighly aggressive etch chemistriesPlasma resistance, compatibility with fluorine-based gases, and acid/base media
CMPAbrasive, alkaline slurry exposureAbrasion resistance, high-pH chemical resistance
Track & LithographyPhotoresist solvent and developer exposureBroad solvent resistance, dimensional stability
Resist StrippingOzone and aggressive strip chemistry exposureExceptional chemical resistance, ozone resistance

Material Solutions: Engineering Polymers With Superior Performance

The primary candidate materials for semiconductor manufacturing sealing solutions are polymers selected for their ability to meet the overlapping requirements just described. The engineering polymers discussed are well-adapted to the challenges related to semiconductor manufacturing environments. 

FFKM (Perfluoroelastomer)

FFKM is considered the top choice for O-rings in semiconductor manufacturing. It is able to deliver the sealing force and resilience of rubber, but with the chemical compatibility of PTFE. It offers a wide operating temperature, approximately -15°F to 620°F. In addition, there are various grades available for  UHP applications that have been optimized for minimal extractable ion content, low metallic contamination, and enhanced O₂/F₂ plasma resistance. FFKM is suitable for static and limited dynamic applications across CVD, CMP, etch, lithography, and stripping processes.

PTFE (Polytetrafluoroethylene)

PTFE is known for its extremely low coefficient of friction, self-lubrication, exceptional chemical compatibility, and high purity. It also performs extremely well in high-temperature, corrosive environments that degrade other material options. Note that PTFE is often the material of choice for highly effective spring-energized seals and reliable encapsulated O-ring jackets.

PEEK (Polyether Ether Ketone)

Like PTFE, PEEK offers good wear resistance and moderate friction properties. It also offers low outgassing, good plasma resistance, and excellent dimensional stability at elevated service temperatures (which can prove crucial). Because of these properties, PEEK is a strong candidate for labyrinth seals and spring-energized seal lips in dynamic semiconductor applications.

Supporting Materials: PI, PCTFE, and PAI (Torlon)

There are some additional supporting materials, namely:

  • Polyimide (PI): known for its low outgassing, excellent cryogenic performance, and high purity
  • PCTFE: offers improved strength and hardness over PTFE while retaining excellent chemical inertness
  • PAI (Torlon): ideal where high pressure, cryogenic temperatures, and corrosive media are all part of the operating environment; known for excellent wear resistance and self-lubrication

Choosing the Right Material

ProcessRecommended MaterialsRationale
CVD / LPCVDFFKM, PEEK, PI (Polyimide)High thermal stability, low outgassing, vacuum-compatible; FFKM grades available for water vapor and ammonia processes
Dry & Wet EtchFFKM, PTFE, PCTFESuperior plasma resistance and broad chemical inertness, including fluorine-based gas compatibility; minimal particle generation
CMP (Chemical Mechanical Polishing)FFKM, PAI (Torlon), PEEKAbrasion-resistant with strong resistance to high-pH slurry chemistry; PAI offers excellent wear resistance and self-lubrication
Track & LithographyFFKM, PTFE, PCTFEBroad solvent resistance; chemically inert to photoresist solvents and developers that attack standard elastomers
Resist StrippingFFKM, PTFEOutstanding ozone resistance and broad chemical compatibility; FFKM specifically rated for ozone and aggressive strip process chemistry

Material selection for semiconductor sealing applications must be matched carefully to the demands of each individual process. For CVD and LPCVD, FFKM, PEEK, and polyimide (PI) are the leading candidates, as all three offer the thermal stability and low outgassing required for sustained high-temperature vacuum operation. Specialized FFKM grades are also available that are formulated specifically for processes involving water vapor and ammonia.

In dry and wet etch environments, FFKM, PTFE, and PCTFE are the materials of choice, owing to their broad chemical inertness and resistance to fluorine-based plasmas and corrosive etch chemistries. Minimal particle generation is a critical secondary requirement in these applications, and all three materials perform well in this regard. For CMP, the combination of abrasive slurry and high-pH chemistry narrows the field to FFKM, PAI (Torlon), and PEEK, with PAI offering a particular advantage due to its exceptional wear resistance and self-lubricating properties.

Track and lithography equipment demands seals that can withstand the photoresist solvents and developers that rapidly degrade conventional elastomers, making FFKM, PTFE, and PCTFE the preferred options given their broad solvent resistance and dimensional stability. Resist stripping represents perhaps the most chemically aggressive environment of all, with ozone exposure compounding an already demanding chemical profile. Here, FFKM and PTFE are the primary recommendations, with select FFKM grades formulated specifically for ozone-intensive strip process chemistry.

Conclusion

In semiconductor manufacturing applications, the seal material selection has an incredible impact on process reliability, contamination control, and total cost of ownership. And there is no universal, one-size-fits-all solution to choosing a seal material. Engineers must look for the optimal combination of material properties to be matched to each process step’s specific chemical, thermal, and purity demands and there are engineering polymers available that are ideal for different applications.

 Advanced EMC is your partner when it comes to semiconductor sealing solutions. With over 100 years of combined experience, Advanced EMC has access to UHP-grade FFKM along with a full range of engineered polymer seal type. The Advanced EMC Sealing Solutions Team is ready to identify and supply the right sealing solution for any semiconductor application, whether standard or custom-designed. Contact Advanced EMC today for a consultation or to request a quote.